NDT Products


Bond Testing

Bond Testing

Blue Star E&E offers premium quality bond testing flaw detectors with unmatched capabilities for detecting discontinuities and other flaws in composite structures. These come with a wide range of measurement features and application-specific options for flaw detection.

BondMaster 600

BondMaster 600 is a perfect combination of multiple mode bond testing software and highly advanced digital electronics. BondMaster 600 offers exceptional ease-of-use with the help of its direct-access keys and streamlined interface. Its capability of generating consistently crisp and high-quality signals enables it to inspect honeycomb composites, metal-to-metal bonds or laminate composites accurately. Regardless of the display mode or inspection method, a simple touch of an accessible key can enable the full-screen mode. The BondMaster 600 bond tester is programmed for a range of standard inspection methods, including pitch-catch RF, pitch-catch impulse, pitch-catch swept, resonance and a notably improved mechanical impedance analysis (MIA).


  • Designed to meet the requirements of IP66
  • Long battery life (up to 9 hours)
  • Compatible with existing BondMaster probes and probes from other manufacturers
  • Bright, 5.7in colour VGA display
  • Full-screen option in any display mode
  • Intuitive interface with application-specific presets
  • Instant display mode toggle using the Run key
  • New scan view (profile)
  • New spectrum view and frequency tracking feature
  • Direct-access key gain adjustment
  • Up to two real-time readings
  • Storage capacity of up to 500 files (program and data)
  • On-board file preview

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